Fig. 3

a Sensing technology by extracorporeal mechanical excitation and intracorporeal mechanical transduction (Cachão et al. 2020) (1 - human tissue; 2 - extracorporeal coil to power the embedded electronics through magnetic induction; 3 - extracorporeal mechanical excitation; 4 - intracorporeal coil used to power the embedded electronics; 5 - intracorporeal monitoring system; 6 - extracorporeal coil to acquire data from the sensor through magnetic induction); b Sensing technology by extracorporeal magnetic induction and extracorporeal mechanical transduction (Cachão et al. 2020) (1 - extracorporeal coil providing movement to the oscillator; 2 - human tissue; 3 - oscillator inside the instrumented implant; 4 - extracorporeal accelerometer that measures vibrations from the oscillator’s impact; 5 - implant); c Instrumented fixation plate embedding a capacitive sensing system to monitor the bone healing process (Cachão et al. 2020; d) Co-surface capacitive sensing to monitor bone-implant interface states (1 - electrodes; 2 - eletric power source; 3 - bone structures; \(\theta\) - angle inclination of electrodes; \(\mathbf {E}\) - electric field) (Cachão et al. 2021)